Successor Maia 300 will ship in 2027, targeting long inputs, fast conversations, and agentic tasks. These three directions point to scenarios in inference workloads that increasingly consume memory capacity and bandwidth: long context needs to fit, fast conversations need low latency, and agentic tasks often require multi-turn, sustained inference.
The confirmed specs are: each Maia 300 chip integrates 8 HBM4 memory stacks, 288 GB total capacity, 18 TB/s bandwidth, and 950 watts rated power. This set of numbers is the "hardest" information in this article, because they are concrete hardware parameters rather than relative performance comparisons.
But specs themselves do not equal actual performance. The 950-watt rated power means the per-chip power budget is quite high, and the report does not say the chip manufacturing process, foundry, or supply chain arrangements, so cost or final energy-efficiency outcomes cannot be inferred from these parameters.