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OCP Global Summit: NVIDIA Opens Vera Rubin Architecture to Help Scale AI Factories Worldwide

At the OCP Global Summit, NVIDIA announced it has contributed its Vera Rubin rack and compute tray designs to the Open Compute Project through the open NVIDIA MGX architecture, giving system builders a common foundation for next-generation AI factory infrastructure. NVIDIA and partners also announced several open standards and innovations spanning AI factory design, grid resilience, networking, and power delivery. The move aims to help scale AI factories worldwide as they grow from megawatts to gigawatts.

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NVIDIA Hands Vera Rubin Rack Design to OCP: Can Open Standards Become the Common Foundation for AI Factories?

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At the OCP Global Summit in San Jose, NVIDIA contributed Vera Rubin rack and compute tray designs to OCP through the MGX architecture, and jointly with hyperscalers released open standards for AI factory design and grid resilience, plus open-source DSX components. These moves point to the same question: as AI factories scale from megawatts to gigawatts, can the industry replace proprietary specifications with a single common standard.

  • NVIDIA contributed Vera Rubin rack and compute tray designs to OCP through the open MGX architecture, providing system builders a common foundation for developing next-generation AI factory infrastructure.
  • NVIDIA and hyperscalers released open standards for next-generation AI factories, covering AI factory design standards and grid resilience standards.
  • NVIDIA released new open-source software components for DSX AI Factory, covering network configuration, cluster validation, rack management and bare-metal provisioning.
Open section navigationOpen Standards Become a Precondition for Gigawatt-Scale AI Factories

Open Standards Become a Precondition for Gigawatt-Scale AI Factories

The core move NVIDIA announced at the OCP Global Summit was contributing key Vera Rubin rack and compute tray designs to OCP through the open NVIDIA MGX architecture, providing system builders a common foundation for developing next-generation AI factory infrastructure. The summit was held at the McEnery Convention Center in San Jose.

This contribution was framed within the narrative of "AI factories moving from megawatts to gigawatts": NVIDIA argues that building such facilities depends not only on advanced computing, and that open standards help the industry scale AI infrastructure faster, more efficiently and more reliably. In other words, open standards are positioned as a precondition for scale, not an option.

A distinction is needed: the contributed designs themselves are confirmed fact; while "open standards can accelerate deployment, improve energy efficiency, and boost tokens per watt performance" is NVIDIA's statement in its press release, and the source provides no independent verification data.

MGX 1.2: Making Rack-Level Liquid Cooling and Power Delivery Reusable Interfaces

The updated MGX 1.2 specification for Vera Rubin AI factories expands the open AI factory architecture, adding rack-level blind-mate liquid cooling, interoperable rack-level interconnect infrastructure, and a liquid-cooled 5,000A busbar for higher-power AI systems.

The specification also adds native 19-inch device support and higher-density rack designs, and improves modularity through configurable I/O bays, fanless liquid-cooled compute trays, and standardized power and cooling interfaces. The architecture supports rack deployments up to 250kW and simplifies maintainability, deployment and infrastructure reuse.

These specifications all come from a unilateral NVIDIA release; the source shows no independent testing or certification, nor any actual deployment cases of 250kW racks. They should therefore be understood as specification targets and design capabilities, not third-party-verified operational data.

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Credibility boundary

All facts in this article come from a single NVIDIA official blog press release (October 12, 2026), which is vendor-published material. The contribution of Vera Rubin rack and compute tray designs to OCP, the contents of the MGX 1.2 specification, the list of DSX open-source components, and the releases of Open Data Center Specification v0.7 and the OCP Grid Resilience Specification are all confirmed by the source as announced items. The USFP "industry's first 400Gb/s module" is a vendor self-description in a joint NVIDIA and Cisco announcement, with no third-party verification, and is labeled in this article as a source claim. MGX 1.2's 250kW rack ceiling, 5,000A busbar, and the grid resilience "under two seconds recovery" are all specification targets or unilateral specifications; the source provides no independent testing, certification or measured data. Products such as Vera Rubin, the Vera CPU rack, ConnectX-10 and BlueField are mostly described in future tense in the source, with no delivery timeline. This article introduces no facts or data beyond the source.

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